Adhesive Application >> PCB mount chip
PCB parts fixed on the wafer can be divided into fixed and underfill dispensing fixed, fast curing,
Reach IC fixed damping anti-shedding purposes.
A. ssd unDERFILL |
A. ssd UNDERFILL
Generally fall off the experiment, ic often have to fall off resulting in poor circumstances, and therefore under the IC, the use of capillarity, glue filling in IC, baking heat drying, to strengthen fixed, anti-drop effect fall
Underfill | Product No. | Curing Time | Method Used |
Single liquid heated | DE-1836 | 80 C/ 30min | After dispensing, the use of capillary phenomenon, so glue evenly distributed heating baking |
|
B. BGA Application
BGA process, strengthen the degree of fall off, you can use an external fixed strengthen
BGA | Product NO. | Curing Time | Method Used |
UV Type | DV-381 | UV curing (about 5-10 seconds) | After IC perimeter glue dispensing, strengthen the reliability of the experiment fell off |
One part (RTV) | DU-400 | 15min/Surface curing | |
One part (Heated) | DE-153 | Heat curing(150 C/10min) | |
Two parts | DEO-200 | 5-10min/Surface curing |
|
C. Electronic Parts reinforcement series
Use glue fixed electronic parts to prevent falling off the fall
Electronic Parts reinforcement series | Curing Time | Product NO. |
UV Type | UV curing (about 5-10 seconds) | DV-381 |
One Part | 15min/Surface curing | DU-400 |
Single liquid heated | Heat curing(150 C/10min) | DE-153 |
Two Parts(Heat) | 5-10min/Surface curing | DEO-200 |
|