Adhesive Applications >> Thermal applications
In response to varying system on the thermal conductivity of the product is divided into several different applications, generally be divided into four categories:
A. thermal grease |
A.Thermal Grease
Thermal grease on the IC and heat sink thermal help more fully, so that the heat sink to quickly achieve the purpose of cooling.
| Thermal Grease | Product NO. | Thermal value | Advantages |
| thermal conductivity | DH-07 | 1.5 W/mk | High thermal conductivity, good price |
| High thermal conductivity | DH-05 | 5 W/mk | High thermal conductivity |
|
B.Thermal Glue
Thermally conductive adhesive
| Curing Methods | Product NO. | Thermal Value | Curing Time | Advantages |
RTV |
DH-150 | 1 W/mk | Surface curing/15 min Fully cured / 24 hRS |
Convenient operation |
| DH-152 | 1.7 W/mk |
Potting type thermal plastic
| Curing Methods | Product NO. | Thermal Value | Advantages |
| Two Parts | DEO-276 | 1 W/mk | RTV，followed by strong |
| Two parts | DEO-2911 | 1 W/mk | RTV, filling thermal use |
|
C.Thermal Tape
Thermal tape for the job on one of the most convenient product that can be cut in accordance with the size of the demand, the price is also competitive.
| Tape thickness | Product NO. | Thermal Value | Base | Advantages |
0.05mm/0.1mm |
DAT-5/10 | 1 W/mk | No base | Thin, heat and fast |
0.16/0.25/0.3mm |
DAT-16/25/30 | 1 W/mk | have base material | Convenient and low cost |
|
D.Thermal PAD
Thermal Pad with a high degree of heat resistance, according to the needs of the crop, but also one-sided or double-sided adhesive, high ease of use, can also fill-off difference
Application of the general chip thermal conductivity, thermal, LED board heat fixed.
| Items | Product NO. | Thermal Value | Advantages |
| General Thermal PAD | DST-170 | 1.7 W/mk | Can fill the gap, increase the heat |
| Moderate thermal pad | DST-450 | 4.5 W/mk | Good thermal conductivity, heat faster |
| High thermal pad | DST-700 | 7 W/mk | High thermal conductivity, heat faster |
|